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CELLULAR HANDSET CHIP MARKETS '10An In-Depth Analysis of Chips Used In CellphonesReport No: 1030 The silicon chips that are the substance of cellphones constitute almost a $50 billion market this year. The most expensive component of cellphones is the LCD display, as illustrated in the chart below. Although displays themselves are not chips, per se, display controllers for increasingly popular touch screens are very important chips. The report also covers more modem-specific chips like digital basebands and communication processors that include integral application processors. The chart illustrates all of the chips that are covered in this extensive 548-page study. We believe that this is the most comprehensive study of all chips that constitute the cellular handset market.
This report goes into even greater detail on the key vendors of all these chip components, as illustrated in the chart below. Discussions on many other companies who are significant in supporting the cellular handset ecosystem add to the depth of this report. Qualcomm continues as the cellular handset chip market leader, followed by Texas Instruments and ST-Ericsson. Next in rank is Infineon, now part of Intel, and continues its significant market presence. The report discusses the vendor changes in the 2010 market, brought about largely through the many acquisitions and mergers (and divestitures) that will shift market shares over the next year or two.
The report ranks the top chip vendors overall and provides vendor market shares for each key chip type (and even by air interface, where applicable). We believe that this is the most comprehensive study of chips that serve the cellular handset market. The complete market and ecosystem coverage is detailed in the accompanying table of contents. AUTHOR Carter L. Horney, a recognized authority on microprocessor and DSP implementation in telecommunications, is the author of this report. Mr. Horney is an independent consultant and Forward Concepts Associate specializing in semiconductor product strategy and market planning. He was formerly Division Planner for Rockwell International’s Digital Communications Division and earlier Strategic Marketing manager for Rockwell’s Semiconductor Products Division. Mr. Horney was responsible for the product planning, which led Rockwell (now Conexant Systems) to dominate the worldwide FAX and high-speed modem chip market. He was appointed a Rockwell Engineering Fellow and received many commendations for outstanding achievement in Computer Architecture, Engineering, Technical Marketing, Product Planning and Customer Relations. Mr. Horney has a B.S. in Mathematics and Physics and an M.S. in Mathematics from Western Illinois University. EDITOR Will Strauss, President of Forward Concepts, is the editor of and significant contributor to this report. Mr. Strauss is internationally recognized as the leading authority on markets driven by digital signal processing (DSP), and wireless is the largest DSP market. SIZE Price (Air courier shipment included with all hard copies) Electronic (PDF): Under the Enterprise License, the report is provided in electronic form (PDF), with the right to distribute to the purchasing organization’s employees, worldwide. |
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