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MOBILE INTERNET DEVICE (MID) & CHIP MARKET OPPORTUNITIES

Strategies & Insight into the Emerging Class of Mobile Internet/Multimedia Devices

Report No: 8040

Table of Contents Press Release Price

In the battle between the PDAs and mobile phones of the late 90s, Smartphones won out, eroding the market for PDAs.  A similar battle is quietly brewing between the mobile phone and PC companies for a new class of emerging low-power mobile lifestyle devices called Mobile Internet Devices (MIDs).
 
For a handheld device, MIDs will have an unprecedented level of multimedia capabilities and typically will come in a tablet-like form factor. In our opinion, MIDs are not designed to replace mobile phones (or Smartphones) but to be used as companion devices. They will rival notebook computers in features and capabilities yet come in a significantly smaller, lighter, fit-into-your-coat-pocket form factor, thus spurring the birth of a whole new class of mobile multimedia devices that fall in between a Smartphone and notebook/tablet computer.

Forward Concepts has completed this study of the market potential for MIDs, providing meaningful forecasts for both MIDs and the integrated circuits that enable them through 2012.  In addition, many example early low-end MIDs are profiled along with profiles of chip suppliers.  Early examples of Ultra Mobile PCs (UMPCs) are also profiled.

Key Study Findings:

With this valuable resource, you will be better equipped to understand the dynamics of this emerging market, to know your potential customers and to be better informed about your competitors.  As with all of our reports, your satisfaction is guaranteed.

  • Mobile Internet Devices (MIDs) represent a new class of mobile communications and lifestyle devices. Its hardware, software and form factor will require design from the ground up in order to meet market requirements for features, price, performance, and power requirements.
  • The user interface will be key to success and will likely need to be capable of responding not only to touch-based inputs but also keep pace with other evolving input methods such as ones based on motion, gesture, placement, etc.
  • Although Apple's 3G iPhone plows new ground in Internet access, user interaction and utility, we don't consider it to be a MID, since we believe a true MID also requires a larger (4- to 6-inch) screen with higher resolution (VGA), TV out and optional Mobile TV capabilities.
  • We predict that global MID shipments will grow from 305,000 units shipped in 2008 to almost 40 million in 2012, reaching $12 billion in revenue.
  • Integrated circuits for MIDs are forecast to grow from $29 million in 2008 to $2.6 billion in 2012.
  • Intel has a much better shot at UMPCs, being predominantly an enterprise play, where x86 compatibility is important, and with battery life expectations in line with notebooks.
  • Texas Instruments, with its mature and proven OMAP application processor family and the largest market share of the stand-alone Smartphone applications processor market, is one of the two best-positioned non-X86 semiconductor vendors for supplying stand-alone applications processors for all classes of MIDs.
  • Qualcomm is the other best-positioned non-X86 semiconductor vendor, with its powerful new SnapDragon application processor and the company's market-leading 3G wireless solutions required for the MID market.

Brief Report Outline:

MID Market Dynamics & Trends:

MID Vendor Profiles

MID Chip Vendor Profiles

Low-End MID Forecasts
Mid-Range MID Forecasts
High-End MID Forecasts
(units & revenue through 2012)

MID Unit Regional Forecasts
By Cellular Air Standard

By Region for Each:

- North America
- Latin America
- Western Europe
- Eastern Europe
- Japan
- South Korea
- China
- India
- S.E. Asia
- Africa & Middle East
- Oceania

MID Chip Forecasts
(units & revenue through 2012):

- High-Definition Apps Processor
- Standard-Definition Apps Processor
- Media Co-Processor
- UMTS Baseband
- EV-DO Baseband
- WiMAX Wave 2 Baseband
- Multiband UMTS RF
- Multiband EV-DO RF
- Multiband WiMAX Wave 2 RF
- WLAN+Bluetooth+FM Chipset
- GPS Receiver
- Mobile TV Receiver
- Low-End (2-3 MP) Image sensors
- Mid-Range (5-7 MP) Image sensors
- High-End (8+ MP) Image sensors
- Touch Screen Controller
- Fingerprint Sensors
- Power Management Units

Appendix:
Wireless & Communications Acronyms/Abbreviations

Index

For additional detail, refer to the
Table of Contents

AUTHOR

Satish Menon is the author of this report and an independent consultant and Forward Concepts Senior Analyst specializing in communications electronics. Most recently, Satish was Chief Technology Officer for a facilities-based provider of wholesale and retail voice telecommunication services where he architected a distributed, high-availability voice network that unified several circuit-based and packet-based protocols into a single packet-core network based on SIP protocol.  Prior to this, he was founder and VP Product Development for Nuntius Systems, Inc. where he was responsible for all engineering activities that included activities involving voice codecs, GSM/GPRS/EDGE baseband/MAC, DSP based lower-power WLAN baseband/MAC and multimedia codecs. Mr. Menon led a multi-disciplinary team of over 120 engineers and was responsible for building several successful products from concept to completion, over a seven year period.  His background includes product management in areas of wireless technology and platforms, real-time embedded systems, DSP implementations of wired/wireless technology and communication protocol stacks along with product positioning and strategic planning expertise. Mr. Menon has also consulted with several high-tech companies in the areas of communication and multimedia technology. He earned his Bachelor’s degree in Electronics and Communication Engineering from REC, Trichy, India and his Master’s degree in Computer Engineering from University of Southern California.

CONTRIBUTOR

Carter L. Horney, a recognized authority on microprocessor and DSP implementation in telecommunications, is a major contributor to this report.  Mr. Horney is an independent consultant and Forward Concepts Associate specializing in semiconductor product strategy and market planning.  He was formerly Division Planner for Rockwell International’s Digital Communications Division and earlier Strategic Marketing manager for Rockwell’s Semiconductor Products Division.  Mr. Horney was responsible for the product planning, which led Rockwell (now Conexant Systems) to dominate the worldwide FAX and high-speed modem chip market.  He was appointed a Rockwell Engineering Fellow and received many commendations for outstanding achievement in Computer Architecture, Engineering, Technical Marketing, Product Planning and Customer Relations.  Mr. Horney has a B.S. in Mathematics and Physics and an M.S. in Mathematics from Western Illinois University.

Size
206 Pages, 46 Figures, 23 Tables, plus Appendix

Price
North American Price: $1,750.00
Additional copies: $200 ea.
International Price: $1,850.00
Additional copies: $300 ea.

Enterprise License : $3,500.00 (worldwide)

Under the Enterprise License, the report is provided in electronic form (PDF), with the right to distribute to the purchasing organization’s employees, worldwide.


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