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WiMAX '08
The 3G+ Broadband Alternative

A Global Analysis of Operators, Equipment, Chips & Broadband Alternatives

Report No: 8010, Published January 2008

Table of Contents Press Release Price

This 300-page report is an in-depth analysis of operators, equipment, chips & broadband alternatives, both wired and wireless. Detailed equipment and chip forecasts (MAC/PHY RF & Comm) are presented through 2012 with 2007 market shares. WiMAX/BWA system houses are profiled with cumulative revenue estimates and 2007 market shares.

Broadband alternatives, both wired and wireless are examined, including Cable, ADSL, UMTS, HSPA, UMB and LTE.  Global WiMAX and BWA deployments by 194 operators in 73 countries are profiled and detailed listings of wired and wireless broadband subscriber populations on a country-by-country basis are presented for 146 countries.

Key study findings include:

  • WIMAX, variously as fixed or mobile services, will bring broadband access services to rural and undeveloped regions of the world.
  • WIMAX growth in India will be strong and will precede 3G rollouts.
  • WIMAX will become large in China, but on the heels of 3G TD-SCDMA.
  • If mobile WiMAX can supplement existing cellular networks as an overlay, it will become a mainstream technology.

The study also notes that the supporting ecosystem is growing, for example:

  • Over 200 Operators are deploying WiMAX, worldwide.
  • Over 30 companies are supplying WiMAX infrastructure equipment.
  • Over 16 companies are providing WiMAX client equipment.
  • Over 19 companies offer 802.16e MAC/PHY baseband chip sets
  • Over 15 companies are now offer WiMAX radio transceiver chips

This extensive market study provides the in-depth information you need to understand dynamics of the broadband market (both wired and wireless), the major players and the competitive landscape.  This valuable information will aid you in writing business plans and enable you to make informed decisions for your company. 

AUTHOR

Carter L. Horney, a recognized authority on microprocessor and DSP implementation in telecommunications, is the author of this study.  Mr. Horney is an independent consultant and Forward Concepts Associate specializing in semiconductor product strategy and market planning.  He was formerly Division Planner for Rockwell International’s Digital Communications Division and earlier Strategic Marketing manager for Rockwell’s Semiconductor Products Division.  Mr. Horney was responsible for the product planning, which led Rockwell (now Conexant Systems) to dominate the worldwide FAX and dial modem chip market.  He was appointed a Rockwell Engineering Fellow and received many commendations for outstanding achievement in Computer Architecture, Engineering, Technical Marketing, Product Planning and Customer Relations.  Mr. Horney has a B.S. in Mathematics and Physics and an M.S. in Mathematics from Western Illinois University.

EDITOR

Will Strauss, President of Forward Concepts, is an internationally-recognized authority on markets driven by DSP Technology, and was a significant contributor to this study.

Size
370 Pages, 61 Figures, 79 Tables, plus Appendix

Price
Hard Copy:
North American Price: $3,500.00
Additional copies: $300 ea.
International Price: $3,600.00
Additional copies: $3500 ea.

Enterprise License : $7,000.00 (worldwide)

Under the Enterprise License, the report is provided in electronic form (PDF), with the right to distribute to the purchasing organization’s employees, worldwide.


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